MTDT 2009
2009 IEEE International Workshop on Memory Technology, Design, and Testing

Ambassador Hotel, Hsinchu
August 31-September 2, 2009, Hsinchu, Taiwan
http://nthucad.cs.nthu.edu.tw/~mtdt09/

Technical Program

PDF version of Final Program

Mini-Tour & Banquet

Latest Update

Registration

Early registration due: Aug. 14th

Online registration is open now!

• MTDT'09 Registration & Hotel Information

Technical Program

Advance Program is out!

Submission

Paper Submission closed!

Important Dates

• Submission deadline: extended to May 3, 2009
• Notification of acceptance: June 4, 2009
• Deadline for final manuscript: June 19, 2009

Call For Paper (in PDF format)

Objective

Following the traditions set up by its predecessors, MTDT09 will provide a forum dedicated to the recent advancements of the memory technology, covering topics such as memory device, circuit design, architecture, fabrication process, verification, yield analysis testing/diagnosis/repair for all kinds of memory such as SRAM, DRAM, Flash memory, EPROM, EEPROM, embedded memories, 3-D memories, content addressable memories, etc.

Scope

Original contributions related to memory design and test technology are solicited. Topics of interest include, but are not limited to, the following categories:

• Next-generation memory device
• Next-generation memory process
• Low-voltage memory circuit design
• 3D memories
• Volatile memory devices
• Non-volatile memory devices
• High-speed memory circuit design
• Low-power memory circuit design
• Fault-tolerant architecture
• Memory compiler
• Memory testing
• Memory built-in self-test
• Memory diagnosis & repair
• Cell Characterization
• Failure analysis
• Fault modeling
• Yield analysis
• Reliability analysis
• Memory for space application
• Verification methodology
• Design and test for SSD

Sponsorship

Sponsored by

• IEEE Taipei Section
• National Tsing-Hua University, Taiwan

Technically Co-Sponsored by

• IEEE Computer Society
  Technical Council on Test Technology
• IEEE Solid-State Circuits Society
• IEEE Circuits and Systems Society
  Technical Committee on VLSI
• National Science Council, Taiwan
• Ministry of Education, Taiwan

Organizing Committee

• General Co-Chairs
  • Cheng-Wen Wu, National Tsing Hua U., Taiwan
  • Rochit Rajsuman, San Jose State-U, USA
• Program Chair
  Chih-Tsun Huang, National Tsing Hua U., Taiwan
• Finance Chair
  Meng-Fan Chang, National Tsing Hua U., Taiwan
• Local Arrangements Chair
  Jen-Chieh Yeh, SOC Technology Center, ITRI, Taiwan
• Publications Chair
  Jin-Fu Li, National Central U., Taiwan
• Registration Chair
  Shyue-Kung Lu, Fu-Len Catholic U., Taiwan

Program Committee

Below is a list of the tentative Program Committee. The definitive list of Program Committee members will appear later on this webpage soon and in the final Call for Paper.

• Robert Aitken, ARM, USA
• Roger Barth, Intel, USA
• Johnny J.-E. Ding, Ardentec Corp., Taiwan
• Christophe Frey, ST Microelectronics, France
• Xiaogang Du, Mentor Graphics, USA
• Yamauchi Hiroyuki, Fukuoka Institute of Tech., Japan
• Charles Hsu, e-Memory Inc., Taiwan
• Shi-Yu Huang, National Tsing Hua U., Taiwan
• Andre Ivanov, University of British Columbia, Canada
• Jerry Shyh-Jye Jou, National Chiao-Tung U., Taiwan
• Ding-Ming Kwai, ITRI, Taiwan
• Ya-Chih King, National Tsing Hua U., Taiwan
• Chung Lam, IBM, USA
• Kuen-Jong Lee, National Cheng Kung U., Taiwan
• Hongchin Lin, National Chung Hsing U., Taiwan
• Fabrizio Lombardi, Northeastern U., USA
• Erik Jan Marinissen, IMEC, Belgium
• Martin Margala, U. of Massachusetts Lowell, USA
• Cecilia Metra, U. of Bologna, Italy
• Saibal Mukhopadhyay, Georgia Tech., USA
• Sharon Murray, Medtronic Micro, USA
• Joe Ting, Etron Tech. Inc., Taiwan
• Joerg Vollrath, Qimonda, German
• Arthur Wang, Winbond, America, USA
• Chua-Chin Wang, National Sun Yat-Sen U., Taiwan
• Vyacheslav Yarmolik, BSUIR, Belarus
• Yervant Zorian, Virage Logic, USA

About Taiwan and Hsinchu

Taiwan is an island of 36,000 square kilometers, 70% of which are covered by spectacular mountains. With a population of about 23 millions, Taiwan is one of the world's major IC design and manufacturing centers. Hsinchu is well-known as the semiconductor capital of Taiwan for its science-based industry park. It is also the home city of the Industrial Technology Research Institute, National Tsing Hua University and National Chiao-Tung University. With a population of about 400 thousands, Hsinchu is about one-hour bus-ride away from Taipei, the real capital of Taiwan.

Further Information

• Email: mtdt09@nthucad.cs.nthu.edu.tw
• URL: http://nthucad.cs.nthu.edu.tw/~mtdt09/